Substrate processing apparatus and method of operating the same

ABSTRACT

Provided is a substrate processing apparatus in which parts are selectively lifted according to the purpose or subject of maintenance/repair during a maintenance/repair operation. The substrate processing apparatus includes: a chamber; a first cover and a second cover on the chamber; a lifting device connected to the first cover and configured to raise and lower the first cover; and a connection region. When the lifting device and the second cover are connected to each other via the connection region or the first and second covers are connected to each other via the connection region, the first and second covers are raised and lowered by the lifting device.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No. 10-2016-0096121, filed on Jul. 28, 2016, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.

BACKGROUND 1. Field

One or more embodiments relate to a substrate processing apparatus, and more particularly, to a substrate processing apparatus configured to be easily maintained and repaired, and a method of operating the substrate processing apparatus (such as a method of maintaining and repairing the substrate processing apparatus).

2. Description of the Related Art

Various processing apparatuses have been developed for processing substrates such as semiconductor substrates or display substrates. Single-type processing apparatuses configured to process substrates one by one had been widely used in early days, and then processing apparatuses configured to process a plurality of substrates at a time to increase productivity per unit time have been developed. For example, vertical batch type reactors capable of simultaneously processing several tens of substrates vertically stacked therein have been used.

In addition, horizontal batch type multiple substrate processing apparatuses configured to simultaneously process a plurality of substrates by processing each substrate like the existing single-type processing apparatuses have been recently widely used. Since horizontal batch type multiple substrate processing apparatuses are capable of simultaneously processing a plurality of substrates and precisely controlling each substrate, the application of horizontal batch type multiple substrate processing apparatuses has been gradually increased.

SUMMARY

One or more embodiments include a substrate processing apparatus (such as a semiconductor substrate deposition apparatus) configured to simultaneously process a plurality of substrates in an efficient and safe manner, and a method of maintaining and repairing the substrate processing apparatus.

Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.

According to one or more embodiments, a substrate processing apparatus includes: a chamber; a first cover and a second cover on the chamber; a lifting device connected to the first cover and configured to raise and lower the first cover; and a connection region, wherein when the lifting device and the second cover are connected to each other via the connection region or the first and second covers are connected to each other via the connection region, the first and second covers are raised and lowered by the lifting device.

The substrate processing apparatus may be a horizontal batch type substrate processing apparatus capable of simultaneously processing a plurality of substrates, and at least one of the first and second covers may include a plurality of accommodation regions accommodating a plurality of substrates.

The substrate processing apparatus may further include: a first supporting part connected to the first cover; and a second supporting part connected to the second cover, wherein the connection region may be formed in at least one of the first and second supporting parts.

The connection region may be formed by a first region of the first supporting part and a second region of the second supporting part.

The substrate processing apparatus may further include an insertion member inserted into the connection region.

The first cover and the second cover may be mechanically connected to each other by the insertion member, and the first and second covers may be raised and lowered by the lifting device.

The first cover may include a processing unit (such as a showerhead assembly). The second cover may include a reaction wall. The second cover may further include an exhaust path.

According to one or more embodiments, a substrate processing apparatus includes: a frame; a chamber disposed on the frame; and at least one lifting device, wherein the chamber includes: a lower chamber including at least one substrate mounting unit; and a top lid unit including at least one gas supply unit, wherein the lifting device is connected to the top lid unit.

The top lid unit may include: a showerhead plate; and a top lid plate.

The substrate processing apparatus may further include: a showerhead plate supporting block; and a top lid plate supporting block.

The showerhead plate supporting block may be connected between the showerhead plate and a cylinder of the lifting device, and the top lid plate supporting block may be connected to the top lid plate.

At least two insertion regions may be formed between the showerhead plate supporting block and the top lid plate supporting block.

Inserts may be inserted into the insertion regions.

The lifting device may include a cylinder.

The cylinder may be configured to lift the top lid unit using air pressure, hydraulic pressure, or elastic force.

According to one or more embodiments, a method of operating a substrate processing apparatus includes: increasing an inside pressure of a chamber to a level equal to an outside pressure of the chamber; and lifting at least one of a first cover and a second cover disposed on the chamber, wherein the lifting of at least one of the first cover and the second cover is performed as follows: the first cover is lifted and the second cover is in contact with the chamber in a first mode, and the first cover and the second cover are lifted in a second mode.

According to one or more embodiments, a method of maintaining and repairing a substrate processing apparatus includes: increasing an inside pressure of a chamber to a level equal to an outside pressure of the chamber; inserting inserts into insertion regions formed between a showerhead plate supporting block and top lid plate supporting block; lifting a cylinder connected to the showerhead plate supporting block; and lifting a showerhead plate and a top lid plate together.

According to one or more embodiments, a method of maintaining and repairing a substrate processing apparatus includes: increasing an inside pressure of a chamber to a level equal to an outside pressure of the chamber; not inserting inserts into insertion regions formed between a showerhead plate supporting block and top lid plate supporting block; lifting a cylinder connected to the showerhead plate supporting block; and lifting only a showerhead plate separately from a top lid plate.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic cross-sectional view illustrating a substrate processing apparatus according to an embodiment;

FIGS. 2 and 3 are views illustrating the substrate processing apparatus depicted FIG. 1 when a first cover and/or a second cover of the substrate processing apparatus are/is lifted;

FIG. 4 is a schematic cross-sectional view illustrating a substrate processing apparatus according to another embodiment;

FIG. 5 is a schematic cross-sectional view illustrating a substrate processing apparatus according to another embodiment;

FIG. 6 is an enlarged view illustrating a first cover and a second cover;

FIG. 7 is a schematic perspective view illustrating a substrate processing apparatus according to an embodiment;

FIG. 8 is a perspective view illustrating a chamber, an upper cover, and a lower cover of the substrate processing apparatus depicted in FIG. 7;

FIGS. 9 and 10 are views illustrating a state in which a top lid unit is separated and lifted away from the chamber for maintenance and repair of the substrate processing apparatus;

FIGS. 11 and 12 are views illustrating a connection structure between the top lid unit and a cylinder unit including a cylinder;

FIG. 13 is a view illustrating a state in which a top lid plate and showerhead plate are lifted together;

FIG. 14 is a view illustrating a state in which only the showerhead plate is lifted;

FIG. 15 is a flowchart illustrating a method of maintaining and repairing a substrate processing apparatus according to an embodiment; and

FIGS. 16 and 17 are flowcharts illustrating methods of maintaining and repairing a substrate processing apparatus according to other embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are merely described below, by referring to the figures, to explain aspects of the present description. Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.

Embodiments will now be described with reference to the accompanying drawings.

The inventive concept may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided to give a clear understanding of the inventive concept to those of ordinary skill in the art. That is, the embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the inventive concept to those of ordinary skill in the art.

In the following description, terms are used only for explaining specific embodiments while not limiting the inventive concept. The terms of a singular form may include plural forms unless referred to the contrary. The meaning of “comprise” and/or “comprising” specifies a shape, a fixed number, a step, a process, a member, an element, and/or a combination thereof but does not exclude other shapes, fixed numbers, steps, processes, members, elements, and/or combinations thereof. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, etc. may be used herein to describe various members, regions, and/or elements, these members, regions, and/or elements should not be limited by these terms. These terms are not used to denote a particular order, a positional relationship, or ratings of members, regions, or elements, but are only used to distinguish one member, region, or element from another member, region, or element. Thus, a first member, region, or element discussed below could be termed a second member, region, or element without departing from the teachings of the inventive concept.

Hereinafter, embodiments will be described with reference to the accompanying drawing. Shapes illustrated in the drawings may be varied according to various factors such as manufacturing methods and/or tolerances. That is, the embodiments are not limited to particular shapes illustrated in the drawings. Factors such as shape changes in manufacturing processes should be considered.

FIG. 1 is a schematic cross-sectional view illustrating a substrate processing apparatus according to an embodiment.

Referring to FIG. 1, the substrate processing apparatus may include a chamber 100, a first cover 110, a second cover 120, and a lifting device 130. The lifting device 130 may be included in the chamber 100.

The chamber 100 provides spaces in which process target objects such as substrates are processed. For example, the chamber 100 may include a first sub-chamber 101 and a second sub-chamber 102. The chamber 100 may have a transfer function, a vacuum sealing function, a heating function, an exhaust function, and/or other processing functions so as to process target objects. In addition, the chamber 100 may provide spaces in which a heating process, a deposition process, an etching process, a polishing process, an ion implanting process, and/or other processing processes are performed on process target object.

The first cover 110 may be placed on the chamber 100 to cover the chamber 100 and may include processing units 115. The processing units 115 may be mechanically connected to the first cover 110 and may include functional members according to the function of the chamber 100. For example, if the chamber 100 has a deposition function, the processing units 115 of the first cover 110 may include reactant supply units (for example, showerhead assemblies). In another embodiment, if the chamber 100 has a polishing function, the processing units 115 of the first cover 110 may include polishing pads.

The second cover 120 may be placed between the first cover 110 and the chamber 100. The second cover 120 may provide spaces for accommodating the processing units 115 connected to the first cover 110. Alternatively, the second cover 120 may provide spaces for processing target objects. For example, if the chamber 100 performs a deposition function, reaction spaces or exhaust paths may be formed in the second cover 120.

The lifting device 130 may be configured to lift the first cover 110 and/or the second cover 120. For example, the lifting device 130 may be connected to the first cover 110 to raise and lower the first cover 110. Connection regions C may be formed in the lifting device 130 and/or the second cover 120. If the lifting device 130 and the second cover 120 are connected to each other via the connection regions C, the second cover 120 may be lifted as the first cover 110 is lifted by the lifting device 130. However, if the lifting device 130 and the second cover 120 are not connected to each other, the second cover 120 may be in contact with the chamber 100 while the first cover 110 is lifted by the lifting device 130.

Although FIG. 1 illustrates that the connection regions C are formed in both of the second cover 120 and the lifting device 130, a connection region C may be formed in only one of the second cover 120 and the lifting device 130. In addition, the connection between the second cover 120 and the lifting device 130 via the connection regions C is not limited to mechanical connection. For example, the second cover 120 and the lifting device 130 may be connected to each other using electromagnetic force.

The substrate processing apparatus of the embodiment is a batch type substrate processing apparatus capable of simultaneously processing a plurality of substrates. For example, the substrate processing apparatus may be a horizontal batch type substrate processing apparatus. In the case of a horizontal batch type substrate processing apparatus configured to process a plurality of substrates, the number of processing modules (that is, the cross sectional area of the substrate processing apparatus) is proportional to the areas of substrates to be processed at a time, and thus the substrate processing apparatus may be inevitably heavy. For example, a top lid of the substrate processing apparatus may be inevitably heavy. Therefore, when the substrate processing apparatus is designed, an effective maintenance/repair time management method may have to be considered so as to address safety issues and improve or maintain productivity.

According to the inventive concept by taking such situations and issues into consideration, a method and apparatus for selectively lifting the first cover 110 and the second cover 120 according to the purpose and subject of maintenance and repair may be provided.

FIGS. 2 and 3 are views illustrating the substrate processing apparatus of FIG. 1 when the first cover 110 and/or the second cover 120 are/is lifted.

FIG. 2 illustrates the case in which the lifting device 130 and the second cover 120 are not connected to each other. While the first cover 110 is lifted by a lifting action of the lifting device 130 connected to the first cover 110, the second cover 120 is in contact with the chamber 100. In this case, a maintenance/repair worker may perform a maintenance/repair operation on a lower surface of the first cover 110 (for example, the processing units 115) and an upper surface of the second cover 120.

FIG. 3 illustrates the case in which the lifting device 130 and the second cover 120 are connected to each other via the connection regions C. Since the lifting device 130 and the second cover 120 are connected to each other, while the first cover 110 is lifted by a lifting action of the lifting device 130, the second cover 120 is also lifted. In this case, a maintenance/repair worker may perform a maintenance/repair operation on a lower surface of the second cover 120 and an upper surface of the chamber 100.

As described above, according to the embodiment, the first cover 110 and/or the second cover 120 may be selectively lifted according to the purpose or subject of maintenance/repair. Therefore, a maintenance/repair operation may be effectively and safely performed on the substrate processing apparatus, and a maintenance/repair time and a shut down time of the substrate processing apparatus may be reduced.

FIG. 4 is a schematic cross-sectional view illustrating a substrate processing apparatus according to another embodiment. The substrate processing apparatus of the current embodiment may be a modification of the substrate processing apparatus of the previous embodiment. Thus, the same description as that presented in the previous embodiment will not be presented here.

Referring to FIG. 4, the substrate processing apparatus may be a horizontal batch type substrate processing apparatus capable of simultaneously processing a plurality of substrates. That is, a plurality of substrates arranged in a horizontal direction may be simultaneously processed. In this case, the weight of a first cover 110 and/or the weight of a second cover 120 may increase in proportion to the number of substrates to be processed at a time.

For example, if the substrate processing apparatus is a horizontal batch type substrate processing apparatus configured to simultaneously processing two substrates, two showerhead assemblies 115′ may be arranged in the first cover 110, and thus the weight of the first cover 110 may be twice the weight of a first cover of a deposition apparatus with a single showerhead assembly configured to process a single substrate at a time.

Similarly, if the substrate processing apparatus is a horizontal batch type substrate processing apparatus configured to simultaneously processing four substrates, four showerhead assemblies may be arranged in the first cover 110, and thus the weight of the first cover 110 may be four times the weight of a first cover of a deposition apparatus with a single showerhead assembly configured to process a single substrate at a time. In addition, if the substrate processing apparatus includes six or more showerhead assemblies, the weight of the first cover 110 may be six or more times the weight of a first cover of a substrate processing apparatus with a single showerhead assembly configured to process a single substrate at a time.

Due to this reason, a plurality of lifting devices 130-1 and 130-2 may be connected to the first cover 110. In FIG. 4, two lifting devices 130-1 and 130-2 are connected to the first cover 110. However, the inventive concept is not limited thereto.

In some embodiments, reaction walls W may be formed in the second cover 120. That is, as illustrated in FIG. 4, substrate holders S accommodating process target objects such as substrates may be lifted to the reaction walls W such that the reaction walls W may be face-sealed. Thus, reaction spaces may be formed by the two showerhead assemblies 115′ connected to the first cover 110, the reaction walls W of the second cover 120, and the substrate holders S.

Connection regions C may be formed between the first cover 110 and the second cover 120. That is, in a first mode (a mode in which only the first cover 110 is lifted), the connection regions C between the first cover 110 and the second cover 120 may not be connected to each other, and thus only the first cover 110 may be lifted by the lifting devices 130-1 and 103-2. However, in a second mode (a mode in which both the first cover 110 and the second cover 120 are lifted), the first cover 110 and the second cover 120 may be physically connected to each other via the connection regions C, and thus both the first cover 110 and the second cover 120 connected to the first cover 110 may be lifted by the lifting devices 130-1 and 130-2.

The connection regions C may be used to enhance sealing between the first cover 110 and the second cover 120. That is, as the first cover 110 and the second cover 120 are connected to each other via the connection regions C, the reaction spaces formed by the first cover 110, the second cover 120, and the substrate holders S may be more securely sealed.

Although FIG. 4 illustrates that the connection regions C are formed in both of the first cover 110 and the second cover 120, the connection regions C may be formed in only one of the first cover 110 and the second cover 120. In addition, the connection between the first cover 110 and the second cover 120 via the connection regions C is not limited to mechanical connection. For example, the first cover 110 and the second cover 120 may be connected to each other using electromagnetic force.

Although FIG. 4 illustrates that the connection regions C are formed in the first cover 110 and the second cover 120, the connection regions C may be formed in other elements. For example, the substrate processing apparatus may further include a first supporting part connected to the first cover 110 and a second supporting part connected to the second cover 120, and a connection region C may be formed in at least one of the first and second supporting parts.

For example, the first supporting part may be provided on the outside of the first cover 110 in connection with the first cover 110 and may include a first region, and the second supporting part may be provided on the outside of the second cover 120 in connection with the second cover 120 and may include a second region (refer to FIGS. 9 to 14). The first and second regions may correspond to the connection regions C.

If an insertion member is inserted in the first and second regions, both the first and second covers 110 and 120 may be lifted by a lifting action of the lifting devices 130-1 and 130-2. However, if the insertion member is not inserted in the first and second regions, since the lifting device 130 is connected to only the first cover 110, only the first cover 110 may be lifted by a lifting action of the lifting device 130.

FIG. 5 is a schematic cross-sectional view illustrating a substrate processing apparatus according to another embodiment. The substrate processing apparatus of the current embodiment may be a modification of the substrate processing apparatuses of the previous embodiments. Thus, the same description as that presented in the previous embodiments will not be presented here.

Optionally, a connection region may be formed in a chamber 100 in addition to a first cover 110 and a second cover 120. For example, the chamber 100 may be comprised of an upper chamber and a lower chamber. In this case, a connection region may be formed between the upper chamber and a cover (e.g. the second cover 120) to selectively separate the upper chamber and the lower chamber from each other.

Referring to FIG. 5, the first and second covers 110 and 120 placed on the chamber 100 may form reaction spaces together with substrate holders S. For example, lower portions of the reaction spaces may be defined by the substrate holders S, upper portions of the reaction spaces may be defined by the first cover 110, and lateral portions of the reaction spaces may be defined by the second cover 120.

If the substrate processing apparatus is a deposition apparatus, the first cover 110 may include showerhead assemblies. The second cover 120 may include reaction walls W (refer to FIG. 6) and exhaust paths E (refer to FIG. 6). Example structures of the first and second covers 110 and 120 are illustrated in FIG. 6.

Referring to FIG. 6, the deposition apparatus may have a downstream exhaust structure. In this case, the downstream exhaust structure may be provided by the second cover 120. In this case, a deposition gas may be sprayed on process target objects through the showerhead assemblies of the first cover 110 and may be discharged through the exhaust paths E of the second cover 120 by a downstream exhaust method.

FIG. 7 is a schematic perspective view illustrating a substrate processing apparatus 1 according to another embodiment, and FIG. 8 is a perspective view illustrating a chamber, an upper cover, and a lower cover of the substrate processing apparatus 1. The substrate processing apparatus 1 of the current embodiment may be a modification of the substrate processing apparatuses of the previous embodiments. Thus, the same description as that presented in the previous embodiments will not be presented here.

Referring to FIGS. 7 and 8, the substrate processing apparatus 1 may include: a frame 2; the chamber including a lower chamber 3 and a top lid unit 4; and cylinder units 7. The cylinder units 7 may be parts of lifting devices.

The lower chamber 3 may be supported by the frame 2. The top lid unit 4 may be placed on an upper end of the lower chamber 3 and may include a showerhead plate 5 and a top lid plate 8. At least two gas supply units 6 may be arranged in the showerhead plate 5. The top lid plate 8 may define lateral portions of reaction spaces or may form exhaust paths.

The gas supply units 6 may include gas supply devices and may form a plurality of reaction spaces (not shown) together with at least two corresponding lower substrate mounting units (not shown). The gas supply units 6 may be connected to gas supply lines connected to a gas source provided outside the chamber, and thus gas may be supplied to the reaction spaces through the gas supply units 6.

The gas supply units 6 may be showerheads configured to supply gas to substrates in a vertical direction. In another embodiment, the gas supply units 6 may be lateral-flow devices configured to supply gas in a horizontal direction. In another embodiment, the gas supply units 6 may be any devices capable of supplying gas to the reaction spaces.

A gate (not shown) may be formed in a lateral side of the lower chamber 3 to allow supply and discharge of substrates, and the gate may be connected to a substrate transfer unit (not shown). A plurality of substrates may be simultaneously or sequentially transferred to the lower chamber 3 through the gate. Then, the substrates may be loaded on the substrate mounting units (not shown) located under the gas supply units 6 and may be unloaded from the substrate mounting units.

According to the embodiment, the substrate processing apparatus 1 configured as a batch type (for example, a horizontal batch type) substrate processing apparatus includes the substrate mounting units corresponding to the gas supply units 6. Therefore, a plurality of substrates may be processed in the reaction spaces.

Substrates may be transferred into the chamber through the gate by a transfer arm (not shown) of the substrate transfer unit and may then be loaded in the substrate mounting units respectively corresponding to the gas supply units 6. When the substrates are loaded in the substrate mounting units, an additional rotation arm (not shown) installed at a center portion of the chamber, between the substrate mounting units may receive the substrates from the transfer arm of the substrate transfer unit and may respectively load the substrates to the substrate mounting units. Alternatively, the rotation arm may not be provided, and the transfer arm of the substrate transfer unit may directly load/unload the substrates to the substrate mounting units. For example, Korean Patent No. 10-782529 discloses a chamber including a plurality of reactors, and rotation arms installed in the chamber between the reactors.

Referring to FIG. 7, the cylinder units 7 are provided on lateral sides of a chamber body of the chamber. In the embodiment, two cylinder units 7 are placed around the center of the chamber in a diagonal direction. However, if the top lid unit 4 is heavy, two additional cylinder units may be placed in another diagonal direction. That is, four cylinder units may be provided. On the contrary, if the top lid unit 4 is not heavy, only one cylinder unit may be provided.

Cylinders of the cylinder units 7 may be moved upward and downward by air or hydraulic pressure. In some embodiments, the cylinders may be moved upward and downward using the elasticity of springs. In addition, the cylinders may include any other devices for vertical operation.

As described above, the showerhead plate 5 includes the gas supply units 6. Thus, the showerhead plate 5 including the gas supply units 6 may be considerably heavy. Therefore, when a maintenance/repair worker lifts the top lid unit 4 (that is, when the lower chamber 3 and reactors arranged inside the lower chamber 3 are exposed to the outside), a safety device may be necessary to support the top lid unit 4 and prevent falling of the top lid unit 4. In such a situation, the cylinder units 7 may support the top lid unit 4 to prevent falling of the top lid unit 4.

The frame 2 may include fixing members (not shown) for connection with the cylinder units 7. In some embodiments, the frame 2 and the cylinder units 7 may be provided in one piece.

FIG. 8 illustrates a state in which the top lid unit 4 including the gas supply units 6 is coupled to the lower chamber 3. In general substrate processing processes (such as a deposition process or an etching process), the lower chamber 3 and the top lid unit 4 are in the state illustrated in FIG. 8.

FIG. 9 illustrates a state in which the top lid unit 4 is lifted away from the lower chamber 3 for maintenance/repair work. The cylinder units 7 of the lifting devices may be used to lift the top lid unit 4.

FIG. 10 illustrates a state in which the top lid unit 4 is lifted away from the lower chamber 3. However, unlike the state shown in FIG. 9, the top lid unit 4 is separated into the showerhead plate 5 and the top lid plate 8, and only the showerhead plate 5 is lifted in a state in which the top lid plate 8 is coupled to the lower chamber 3.

The showerhead plate 5 and the top lid plate 8 may constitute the top lid unit 4 and may be selectively separated from each other using the cylinder units 7. Therefore, the showerhead plate 5 may be separated to perform a maintenance/repair operation on the showerhead plate 5, or both the top lid plate 8 and the showerhead plate 5 may be lifted to perform a maintenance/repair operation on the lower chamber 3.

For example, when it is required to replace showerheads (not shown) arranged in the showerhead plate 5 or to repair the gas supply units 6 connected to the showerheads, only the showerhead plate 5 may be lifted instead of lifting both the showerhead plate 5 and the top lid plate 8. In addition, when it is required to perform a maintenance/repair operation on the inside of the lower chamber 3 (for example, on the rotation arm or the substrate mounting units), both the showerhead plate 5 and the top lid plate 8 may be lifted to perform a maintenance/repair operation on the inside of the lower chamber 3.

As described above, according to the embodiment, the showerhead plate 5 and the top lid plate 8 of the top lid unit 4 may be selectively separated from each other, and thus the substrate processing apparatus 1 may be more efficiently maintained and repaired.

FIGS. 11 and 12 illustrate an example connection structure between the top lid unit 4 and a cylinder unit 7 including a cylinder 9.

Referring to FIGS. 11 and 12, the substrate processing apparatus 1 may further include a showerhead plate supporting block 11 and at least one top lid plate supporting block 12.

The showerhead plate supporting block 11 may be mechanically connected to the showerhead plate 5 (for example, using fasteners such as screws). In some embodiments, the showerhead plate supporting block 11 and the showerhead plate 5 may be formed in one body. Similarly, the top lid plate supporting block 12 and the top lid plate 8 may be formed in one body or may be mechanically coupled to each other.

The showerhead plate supporting block 11 may be connected between the showerhead plate 5 and the cylinder 9. That is, an upper portion of the cylinder 9 may be formed in one body with or may be mechanically connected to a lower portion of the showerhead plate supporting block 11. Therefore, when the cylinder 9 is lifted by, for example, air pressure, the showerhead plate 5 coupled to or formed in one body with the showerhead plate supporting block 11 may be lifted.

On the contrary, the top lid plate supporting block 12 and the top lid plate 8 coupled to the top lid plate supporting block 12 are physically separate from the cylinder 9, and thus the top lid plate supporting block 12 and the top lid plate 8 are not lifted when the cylinder 9 is lifted.

Referring to FIG. 12, insertion regions 13 may be formed between both lateral sides of the showerhead plate supporting block 11 and the top lid plate supporting block 12 to receive inserts 10. If the inserts 10 are inserted into the insertion regions 13, the showerhead plate supporting block 11 and the top lid plate supporting block 12 may be mechanically fixed to each other by the inserts 10. Therefore, when the cylinder 9 is lifted, both the top lid plate 8 and the showerhead plate 5 may be simultaneously lifted.

FIG. 13 illustrates a state in which the top lid plate 8 and the showerhead plate 5 are lifted together, and FIG. 14 illustrates a state in which only the showerhead plate 5 is lifted.

Referring to FIG. 13, if the inserts 10 are inserted into the insertion regions 13 between the top lid plate supporting block 12 and the showerhead plate supporting block 11, the top lid plate 8 and the showerhead plate 5 are lifted together. However, as illustrated in FIG. 14, if the inserts 10 are not inserted, only the showerhead plate 5 is lifted. As described above, according to the embodiment, the top lid unit 4 may be selectively lifted according to the purpose of maintenance/repair work.

At least one insertion region may be formed between the showerhead plate supporting block 11 and the top lid plate supporting block 12. For example, as illustrated in FIG. 12, two insertion regions 13 may be formed, and the inserts 10 may be inserted into the insertion regions 13. Each of the insertion regions 13 may include a first insertion region I1 formed in each of the top lid plate supporting block 12 and a second insertion region I2 formed in the showerhead plate supporting block 11.

Each of the inserts 10 may have a cross section in which a first portion extending in a vertical direction meets a second portion extending in a horizontal direction at a right angle (that is, an L-shaped cross section). The first portions of the inserts 10 may be inserted into the first insertion regions I1 formed in the top lid plate supporting block 12, and the second portions of the inserts 10 may be inserted into the second insertion regions I2 formed in the showerhead plate supporting block 11. In the embodiment, it is described that the first portions extend in a vertical direction, and the second portions extend in a horizontal direction. However, the inventive concept is not limited thereto. That is, the first portions may extend in any direction such as a horizontal direction, and the second portions may extend in a direction different from the direction in which the first portions extend.

In some embodiments, the cross sections of the inserts 10 may further include third portions extending from the second portions (for example, at right angles) in addition to the first and second portions. The third portions may be shorter than the second portions, and thus the inserts 10 may have J-shaped cross sections. The third portions of the inserts 10 may be inserted into the second insertion regions 12 formed in the showerhead plate supporting block 11. That is, the second insertion regions 12 of the showerhead plate supporting block 11 may have an L-shape, and the second and third portions of the inserts 10 may be inserted into the second insertion regions 12 having an L-shape. This structure may improve mechanical contact between the top lid plate supporting block 12, the inserts 10, and the showerhead plate supporting block 11.

In other embodiments, the inserts 10 may include first openings 01 and second openings 02. The first openings 01 of the inserts 10 may be connected to openings 0 of the top lid plate supporting block 12 using fasteners such as screws, and thus the inserts 10 and the top lid plate supporting block 12 may be more securely fixed to each other. In addition, the second openings 02 of the inserts 10 may be connected to openings (not shown) of the top lid plate 8 using fasteners such as screws, and thus the inserts 10 and the top lid plate 8 may be more securely fixed to each other.

FIG. 15 is a flowchart illustrating a method of maintaining and repairing a substrate processing apparatus according to an embodiment.

Referring to FIG. 15, in a first operation S1510, the inside pressure of a chamber is increased to a level equal to the outside pressure of the chamber. Before the substrate processing apparatus is dissembled to perform a maintenance/repair operation after a process such as a deposition, etching, or cleaning process is performed using the substrate processing apparatus, the inside and outside pressures of the substrate processing apparatus may be balanced by increasing the inside pressure of the substrate processing apparatus to a level equal to the outside pressure of the substrate processing apparatus.

Thereafter, in a second operation S1520, the substrate processing apparatus may be dissembled by lifting at least one of first and second covers arranged on the chamber. Such a dissembling operation may be performed using a lifting device (for example, a cylinder using air pressure, hydraulic pressure, and/or elastic force).

During the second operation S1520, at least one of the first and second covers may be selectively lifted depending on whether the first and second covers are physically coupled to each other (or the first and second covers are separate from each other). For example, if the first and second covers are separate from each other (a first mode), only the first cover may be lifted during the second operation S1520, and the second cover may be maintained in contact with the chamber (operation S1523).

If the first and second covers are coupled to each other (a second mode), both the first and second covers may be lifted during the second operation S1520 (operation S1525). When the lifting device and the second cover or the first and second covers are in connection with each other via connection regions as described above, the second operation S1520 may be performed in the second mode.

After the second operation S1520, a maintenance/repair operation may be performed on the substrate processing apparatus (operation S1530). As described above, at least one of the first and second covers may be selectively lifted, and thus the first cover, the second cover, and/or the chamber may be selectively maintained and repaired.

FIGS. 16 and 17 are flowcharts illustrating methods of maintaining and repairing a substrate processing apparatus according to other embodiments. The maintaining and repairing methods of the embodiments may be modifications of the maintaining and repairing method of the previous embodiment. Thus, the same description as that presented in the previous embodiment will not be presented here.

In the embodiment illustrated in FIG. 16, inserts are inserted such that a first cover (for example, a showerhead plate) and a second cover (for example, a top lid plate) may be lifted together. First, the inside pressure of a chamber is increased to a level equal to the outside pressure of the chamber (operation S1610). Thereafter, the inserts are inserted into insertion regions formed between a showerhead plate supporting block and at least one top lid plate supporting block (operation S1620). Therefore, the showerhead plate supporting block and the top lid plate supporting block may be physically fixed. Thereafter, if a cylinder connected to the showerhead plate supporting block is lifted (operation S1630), the showerhead plate and the top lid plate may be lifted together (operation S1640).

In the embodiment illustrated in FIG. 17, the inserts are not inserted, and only the showerhead plate is lifted. First, the inside pressure of the chamber is increased to a level equal to the outside pressure of the chamber (operation S1710). Thereafter, the inserts are not inserted into the insertion regions formed between the showerhead plate supporting block and the top lid plate supporting block (operation S1720). Since the showerhead plate supporting block and the top lid plate supporting block are separate from each other, if the cylinder connected to the showerhead plate supporting block is lifted (operation S1730), only the showerhead plate may be lifted (operation S1740).

As described above, according to the substrate processing apparatus and the maintaining and repairing method of the one or more of the above embodiments, the top lid unit including the showerhead plate and the top lid plate may be selectively lifted according to the purpose of maintenance and repair work, and thus the substrate processing apparatus may be more efficiently and safely maintained and repaired. In addition, a maintenance/repair time and a shut down time of the substrate processing apparatus may be reduced, and thus the productivity of the substrate processing apparatus may be improved.

It should be understood that embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments.

While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the inventive concept as defined by the following claims. 

What is claimed is:
 1. A substrate processing apparatus comprising: a chamber; a first cover and a second cover on the chamber; a lifting device connected to the first cover and configured to raise and lower the first cover; and a connection region, wherein when the lifting device and the second cover are connected to each other via the connection region or the first and second covers are connected to each other via the connection region, the first and second covers are raised and lowered by the lifting device.
 2. The substrate processing apparatus of claim 1, wherein the substrate processing apparatus is a horizontal batch type substrate processing apparatus capable of simultaneously processing a plurality of substrates, and at least one of the first and second covers comprises a plurality of accommodation regions accommodating a plurality of substrates.
 3. The substrate processing apparatus of claim 1, further comprising: a first supporting part connected to the first cover; and a second supporting part connected to the second cover, wherein the connection region is formed in at least one of the first and second supporting parts.
 4. The substrate processing apparatus of claim 3, wherein the connection region is formed by a first region of the first supporting part and a second region of the second supporting part.
 5. The substrate processing apparatus of claim 1, further comprising an insertion member inserted into the connection region.
 6. The substrate processing apparatus of claim 5, wherein the first cover and the second cover are mechanically connected to each other by the insertion member, and the first and second covers are raised and lowered by the lifting device.
 7. The substrate processing apparatus of claim 1, wherein the first cover comprises a processing unit.
 8. The substrate processing apparatus of claim 1, wherein the second cover comprises a reaction wall.
 9. The substrate processing apparatus of claim 8, wherein the second cover further comprises an exhaust path.
 10. A substrate processing apparatus comprising: a frame; a chamber disposed on the frame; wherein the chamber comprises: a lower chamber comprising at least one substrate mounting unit, a top lid unit comprising at least one gas supply unit; and at least one lifting device connected to the top lid unit.
 11. The substrate processing apparatus of claim 10, wherein the top lid unit comprises: a showerhead plate; and a top lid plate.
 12. The substrate processing apparatus of claim 11, further comprising: a showerhead plate supporting block; and a top lid plate supporting block.
 13. The substrate processing apparatus of claim 12, wherein the showerhead plate supporting block is connected between the showerhead plate and a cylinder of the lifting device, and the top lid plate supporting block is connected to the top lid plate.
 14. The substrate processing apparatus of claim 13, wherein at least two insertion regions are formed between the showerhead plate supporting block and the top lid plate supporting block.
 15. The substrate processing apparatus of claim 14, wherein inserts are inserted into the insertion regions.
 16. The substrate processing apparatus of claim 10, wherein the lifting device comprises a cylinder.
 17. The substrate processing apparatus of claim 16, wherein the cylinder is configured to lift the top lid unit using air pressure, hydraulic pressure, or elastic force. 